Sanyo Electric Co. To License Shellcase's Wafer Level Chip Size Packaging Technology Shellcase, a developer and provider of Wafer Level Chip Size Packaging (WLCSP) announced today that SANYO Electric Co. has licensed its ShellOP, WLCSP technology. SANYO will incorporate Shellcase's ShellOP production technology into one of its manufacturing sites in Japan, and production is planned to begin in Q2 2002. Shellcase will receive license and royalty fees from SANYO, though the financial terms of the agreement were not disclosed. According to Shlomo Oren, President & CEO of Shellcase, "We are proud to cooperate with SANYO, a world leader in the CCD marketplace. SANYO's acceptance of our packaging technology is another important milestone for Shellcase in achieving worldwide recognition of our cutting-edge technology." Mr. Akiyama, General Manager of SANYO Systems LSI added, "We view Shellcase's packaging technology as an ideal fit for SANYO's special CCD. With the growth of imaging applications for mobile and cellular phones steadily increasing, we believe that Shellcase's packaging quality and SANYO's superior CCD technology compliment each other in a way that will enable SANYO to become a leader in the miniature camera module market." SANYO and Shellcase plan to strengthen their cooperation by expanding the line of products offered in the ShellOP WLCSP packaging to include VGA and Mega pixel imagers, among others. About Shellcase Shellcase is a leading global supplier of innovative wafer level chip size packaging solutions for semiconductor devices for the growing digital imaging, data telecommunications and PDA markets. Shellcase has developed a proprietary, patented chip-size packaging technology using a wafer-level process. The company provides contract packaging services and also licenses its advances CSP technology, ShellBGA and ShellOP, to IC manufacturers worldwide. Contract packaging services are provided at the manufacturing facility in Jerusalem and through a joint venture in Taiwan. . Shellcase is publicly traded on the Canadian Venture Exchange under the symbol SSD. The company was founded in 1993 and has its headquarters in Jerusalem, Israel, offices in Silicon Valley. About SANYO Electric Co.: SANYO Semiconductor Company is one of the five principle companies that make up SANYO Electric Co., Ltd. The Company provides semiconductor devices, flat panel displays and system solutions for leading applications in the electronics industry such as mobile communication equipment, PC/PC related products and analog/digital AV equipment. In the fiscal year 2000 (ending March 2001) the SANYO Semiconductor Company achieved a total production of 341 billion yen with approximately 15,000 employees worldwide including subsidiary companies. Further information is available at http://www.semic.sanyo.co.jp

27 June 2001 Chip scale Packaging