Sanyo Electric Co. To License Shellcase's Wafer Level Chip Size Packaging Technology
Shellcase, a developer and provider of Wafer Level Chip Size Packaging (WLCSP) announced today that SANYO Electric Co. has licensed its ShellOP, WLCSP technology. SANYO will incorporate Shellcase's ShellOP production technology into one of its manufacturing sites in Japan, and production is planned to begin in Q2 2002. Shellcase will receive license and royalty fees from SANYO, though the financial terms of the agreement were not disclosed.
According to Shlomo Oren, President & CEO of Shellcase, "We are proud to cooperate with SANYO, a world leader in the CCD marketplace. SANYO's acceptance of our packaging technology is another important milestone for Shellcase in achieving worldwide recognition of our cutting-edge technology."
Mr. Akiyama, General Manager of SANYO Systems LSI added, "We view Shellcase's packaging technology as an ideal fit for SANYO's special CCD. With the growth of imaging applications for mobile and cellular phones steadily increasing, we believe that Shellcase's packaging quality and SANYO's superior CCD technology compliment each other in a way that will enable SANYO to become a leader in the miniature camera module market."
SANYO and Shellcase plan to strengthen their cooperation by expanding the line of products offered in the ShellOP WLCSP packaging to include VGA and Mega pixel imagers, among others.
|27 June 2001|