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Groupe Arnaud Electronics

New miniature applications to be presented by Shellcase at SEMICON West

Shellcase invites you to visit us at booth #15320 at SEMICON West in San Jose, July 18-20 where we will present several new miniature applications featuring Shellcase's cutting-edge packaging technology.

Among the innovative products Shellcase will feature at SEMICON West are:

  • SANYO's World's Smallest CCD Camera Module - 11.2 mm (width) x 11.2 mm (height) x 6.7 mm (depth including lens) for cellular telephones. This CCD sensor utilizes Shellcase's ShellOP WLCSP packaged with a final dimension of 2.92 x 4.03 mm.
  • The DELSY® CMOS Sensor is an innovative finger print identification module, utilizing the ShellOP wafer level package with a unique combination of a fiber optic faceplate. The total CMOS package size is 15.6 x 20 mm.
  • Leaf C-Most, an innovative 6.6-mega pixel CMOS-based sensor, represents a breakthrough in the area of digital imaging. The C-Most sensor incorporates Shellcase's ShellOP WLCSP package with a total dimensions of 38 x 25.6 mm. The C-Most is a high-end application offering an exceptionally high image transfer rate.
  • WIZCOM Technology's Stylus Pen is designed for the PDA and cellular phone markets and includes an input device for scanning and translating text. This device incorporates a ShellOP WLCSP package that is 9.6 x 1.3 mm in dimension in its linear sensor.

    In the last year, Shellcase has made great strides, raising $20 million in financing, seeing ShellOP gain greater market acceptance and opening a production facility as a joint venture in Taiwan. In addition, ShellOP production is ramping up quickly and can be found in products of well-known companies, among them: Sanyo, CreoScitex and Given Imaging (the camera in a pill).

    SHELLCASE LOOKS FORWARD TO SEEING YOU AT BOOTH #15320 AT SEMICON WEST IN SAN JOSE, JULY 18-20

    About Shellcase
    Shellcase is a leading global supplier of innovative wafer level chip size packaging solutions for semiconductor devices for the growing digital imaging, data telecommunications and PDA markets. Shellcase has developed a proprietary, patented chip-size packaging technology using a wafer-level process. The company provides contract packaging services and also licenses its advances CSP technology, ShellBGA and ShellOP, to IC manufacturers worldwide. Contract packaging services are provided at the manufacturing facility in Jerusalem and through a joint venture in Taiwan. Shellcase is publicly traded on the Canadian Venture Exchange under the symbol SSD. The company was founded in 1993 and has its headquarters in Jerusalem, Israel and offices in Silicon Valley.

    Contact:
    Eric Rosenberg
    Marketing Communications Manager
    Shellcase LDT.
    Phone: +972-2-6798890 Ext. 218
    Fax: +972-2-6798850
  • 10 July 2001


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