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Groupe Arnaud Electronics

Shellcase to invest $8 million to expand production facility

Shellcase, a leading developer and provider of Wafer Level
Chip Size Packaging (WLCSP), announced today that it is expanding its
production facility in Jerusalem at a cost of $8 million. The expansion
began in May 2001 following the successful closing of a $20 million private
placement in April 2001. The new facility will increase the production
floor three fold and will be completed in November 2001.

The expanded facility will add 1500 square meters of clean room production
floor space which will be equipped with state-of-the-art production
equipment for processing semiconductor silicon wafers and packaging them in Shellcase's innovative miniaturization packaging technologies. Shellcase
is in the process of a major recruiting drive in advance of the new facility's
opening, in addition to the 150 employees already employed.

"Demand for Shellcase's products remains strong, despite the slowdown in
the global chip industry," according to Shlomo Oren, Shellcase's President and CEO. "The larger facility, together with our joint venture facility in
Taiwan, will provide Shellcase with the capacity we need to accommodate our present as well as expected future growth. Obviously, this necessitates
expanding our workforce in all departments: Engineering and Research &
Development, Marketing and Operations."

Shellcase is experiencing high growth and market demand for it products
from leading semiconductor companies as well as from end product developers worldwide. In June, Sanyo Electric of Japan signed a license agreement with Shellcase for the production of a miniature CCD camera module and production will reach 500,000 cameras per month by Q4 2001. Among the end product developers utilizing Shellcase's technology are CreoScitex, developer of an innovative 6.6-mega pixel CMOS-based sensor for digital photography, Delsy, producer of an innovative finger print identification module with a fiber optic faceplate, as well as Given Imaging of Yoqneam, Israel, developer of the camera-in-a-pill, which recently received FDA approval in the United States.


About Shellcase
Shellcase is a leading global supplier of innovative wafer level chip size packaging solutions for semiconductor devices for the growing digital imaging, data telecommunications and PDA markets. Shellcase has developed a proprietary, patented chip-size packaging technology using a wafer-level process. The company provides contract packaging services and also licenses its advances CSP technology, ShellBGA and ShellOP, to IC manufacturers worldwide. Contract packaging services are provided at the manufacturing facility in Jerusalem and through a joint venture in Taiwan. Shellcase is publicly traded on the Canadian Venture Exchange under the symbol SSD. The company was founded in 1993 and has its headquarters in Jerusalem, Israel and offices in Silicon Valley.

Contact:
Eric Rosenberg
Marketing Communications Manager
Shellcase LDT.
Phone: +972-2-6798890 Ext. 218
Fax: +972-2-6798850

5 September 2001


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