News
Back to News
Groupe Arnaud Electronics

Shellcase licenses wafer-level chip-scale packaging technology

Shellcase has licensed its wafer-level chip-scale packaging technology to FICTA Technology (First International Computer Group) of Taiwan.

FICTA will use ShellCase's proprietary technology to package DRAM chips and other devices in volume from 1999 in their Hsinchu, Taiwan plant.

15 October 1998


Related Products
Chip scale packaging

HomeProductsCompaniesContact UsAbout UsNews