Size: rectangular wafers with sides 10-30 mm.
Thickness: 0.6-1.0 mm
Polishing: two sides polished
N-TYPE Cd(x)Hg(1-x)Te annealed
Composition (X) 0.190-0.240, 0.270-0.330
Please contact us for other X value ranges
Uniformity of Composition
DX= +/-0.005; +/-0.003
Tighter uniformity up to DX=+/-.0015 available upon request
Carrier Conc. at 77K, cm-3 1-8 E14 for X = 0.190-0.240
Carrier Conc. at 77K, cm-3 0.8-7 E14 for X = 0.270-0.330
Mobility at 77K, cm2/V-s. > 1 E5 for X = 0.190-0.240
Mobility at 77K, cm2/V-s. > 5 E4 for X = 0.270-0.330
P-TYPE Cd(x)Hg(1-x)Te
Composition (X) 0.190-0.240, 0.270-0.330
Please contact us for other X value ranges
Uniformity of Composition DX +/-0.005; +/-0.003
Tighter uniformity up to DX = +/-.0015 available upon request
Carrier Conc. at 77K, cm-3 0.3-2 E16 for X = 0.190-0.240
Carrier Conc. at 77K, cm-3 0.2-2 E16 for X = 0.270-0.330
Mobility at 77K, cm2/V-s. > 400 for X = 0.190-0.240
Mobility at 77K, cm2/V-s. > 300 for X = 0.270-0.330
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