Best Line, Every time
DDK AccuScribe Diamond Tools have proven to be the best choice for reducing
costs and improving yields. Each tool is precisely made with centered tables,
collinear edges and accurate angles to dramatically reduce setup and changeover
cost. These accurate, long-lasting tools provide a narrower scribe line
to improve your scribe and break operations.
Use the guide
provided below to select the tool that best fits your application.
DDK engineers have incorporated their intimate knowledge of diamond to develope
a sophisticated edge generation process.
from Prototype through Retirement
work closely with customers to make their design ideas a reality. Our experience
in design engineering, manufacturing, and service has made DDK the industry
standard for improving scribe and break technology. Dedicated processing equipment
ensures product consistency. And, as with all our products, our AccuScribe
tools come with an unconditional guarantee and exceptional customer service.
is the Diamond
have incorporated extensive knowledge of diamond and years of experience to
develop affordably priced diamond scribe tools. All DDK products are made
in the USA with the finest materials, the most precise equipment, the highest
level of craftsmanship, the most exhaustive testing program, and the strongest
guarantee available. DDK makes an entire range of standard diamond scribing
tools - those with two, three, four and six edges.
are used in scribe and break technology for:
- Optical detectors
- Light emitting diodes (LEDs)
- Laser diodes
AccuScribe Diamond Tools fit Dynatex,
Loomis and other scribe and break machines for semiconductor wafer dicing.
The scribe and break process is
ideal for III-V compounds and other materials like:
- Gallium Arsenide
- Indium Phosphide
- Silicon Germanium
to AccuScribe Tools
tools suitable for all semi-conductor wafers
4-point tool with a table, and four scribe edges with toes and heels is
widely used for Si, GaAs, InP and GaN wafer scribing. Good for experimentation
with toe v/s heel scribing.
||Our 4-pint tool with a table,
and four scribe edges with toes, no heels is used for toe scribing in routine
||Our 4-point tool with four
scribe edges with hells, no toes, and no table is used for heel scribing
tools suitable for deep access scribing
Our 2-point tool with a table, and two scribe edges with toes and heels,
is used for scribing semiconductor wafers between tall components. Two-point
geometry produces tools with sharper scribe edges.
tools designed for sapphire wafers
Our tool with
a small table and three short cutting edges is used for scribing sapphire
and other hard materials.
tools designed for harder materials
A strong tipped
tool, with a table and six scribe edges with toes, no heels.
tools designed for III/V semiconductors
A very sharp
2-point tool, with a table and cutting edges with toes, is designed especially
to provide narrow scribe lines for toe scribing of III/V semiconductor
wafers like GaAs and InP.
All diamonds used are
gem-quality with pale yellow or better color. Raw diamond is free from inclusions
and shows only minimal stress under cross-polarized light. Near-perfect crystals
are chosen so that structure is optimal.
Selected diamonds are positioned
to provide the most accurate, durable edges. We orient the diamond for optimal
mounting with the desired crystalline plane, so that facets can be polished
for perfect edges and points with superior durability.
Diamonds are mounted to ensure
a tight grip during processing and use. DDK uses a proprietary braze in combination
with magnetic, thermally stable shank materials.
Diamonds are precisely sharpened
using the finest diamond powder and most accurate lap spindles available.
The edges and points
of each AccuScribe diamond tool are inspected at high magnification to ensure
quality. Edges and points are inspected at 60x during manufacture and 400x
afterwards. Angles and dimensions are measured on an optical comparator at
50x. This data can be traceable to each tool through a unique serial number
to help you with application testing or troubleshooting.