AccuScribe Diamond Tools   The Best Line, Every time DDK AccuScribe Diamond Tools have proven to be the best choice for reducing costs and improving yields. Each tool is precisely made with centered tables, collinear edges and accurate angles to dramatically reduce setup and changeover cost. These accurate, long-lasting tools provide a narrower scribe line to improve your scribe and break operations. Use the guide provided below to select the tool that best fits your application.   DDK engineers have incorporated their intimate knowledge of diamond to develope a sophisticated edge generation process. Exceptional Service from Prototype through Retirement DDK engineers work closely with customers to make their design ideas a reality. Our experience in design engineering, manufacturing, and service has made DDK the industry standard for improving scribe and break technology. Dedicated processing equipment ensures product consistency. And, as with all our products, our AccuScribe tools come with an unconditional guarantee and exceptional customer service. The Difference is the Diamond DDK engineers have incorporated extensive knowledge of diamond and years of experience to develop affordably priced diamond scribe tools. All DDK products are made in the USA with the finest materials, the most precise equipment, the highest level of craftsmanship, the most exhaustive testing program, and the strongest guarantee available. DDK makes an entire range of standard diamond scribing tools - those with two, three, four and six edges. Applications Our tools are used in scribe and break technology for: MMICs Transistors Optical detectors Light emitting diodes (LEDs) Laser diodes AccuScribe Diamond Tools fit Dynatex, Loomis and other scribe and break machines for semiconductor wafer dicing. The scribe and break process is ideal for III-V compounds and other materials like: Gallium Arsenide Indium Phosphide Silicon Germanium Ceramics Sapphire Silicon Glass Guide to AccuScribe Tools 4-point tools suitable for all semi-conductor wafers Our 4-point tool with a table, and four scribe edges with toes and heels is widely used for Si, GaAs, InP and GaN wafer scribing. Good for experimentation with toe v/s heel scribing. Our 4-pint tool with a table, and four scribe edges with toes, no heels is used for toe scribing in routine volume production Our 4-point tool with four scribe edges with hells, no toes, and no table is used for heel scribing only 2-point tools suitable for deep access scribing Our 2-point tool with a table, and two scribe edges with toes and heels, is used for scribing semiconductor wafers between tall components. Two-point geometry produces tools with sharper scribe edges. 3-point tools designed for sapphire wafers Our tool with a small table and three short cutting edges is used for scribing sapphire and other hard materials. 6-point tools designed for harder materials A strong tipped tool, with a table and six scribe edges with toes, no heels. NEW Laser-Point™ tools designed for III/V semiconductors A very sharp 2-point tool, with a table and cutting edges with toes, is designed especially to provide narrow scribe lines for toe scribing of III/V semiconductor wafers like GaAs and InP. All diamonds used are gem-quality with pale yellow or better color. Raw diamond is free from inclusions and shows only minimal stress under cross-polarized light. Near-perfect crystals are chosen so that structure is optimal. Selected diamonds are positioned to provide the most accurate, durable edges. We orient the diamond for optimal mounting with the desired crystalline plane, so that facets can be polished for perfect edges and points with superior durability. Diamonds are mounted to ensure a tight grip during processing and use. DDK uses a proprietary braze in combination with magnetic, thermally stable shank materials. Diamonds are precisely sharpened using the finest diamond powder and most accurate lap spindles available. The edges and points of each AccuScribe diamond tool are inspected at high magnification to ensure quality. Edges and points are inspected at 60x during manufacture and 400x afterwards. Angles and dimensions are measured on an optical comparator at 50x. This data can be traceable to each tool through a unique serial number to help you with application testing or troubleshooting.

GaAs GaSb GaP InP InAs InSb Silicon Sapphire Germanium